Copper and Gold Wire Bonding (5/11/20) Boxborough, MA
WHEN: May 11, 2020
TIME: 8:30am to 4:30pm
Achieving high wirebond yields requires rigorous attention to details and statistical process control. In this one day seminar, taught by our guest Lee Levine, you will learn about ultrasonic welding, intermetallics and intermetallic failures of gold and copper, copper wire bonding, and more in this detailed course meant for wire bond process engineers, technicians, quality control engineers and managers.
This course is intended for new wire bonders, but many experienced bonders and process/quality engineers have taken the course and learned a great deal. The classroom training is open to anyone, but the “hands on” activities are limited to 3 or 4 students at a time due to logistical reasons.
Click here to see the outline.
242 Adams Pl.
Boxborough, MA 01719