VIRTUAL: Microelectronic Packaging Failure Modes and Analysis (1/28/2021 – 1/29/2021)
WHEN: January 28-29, 2021 (2 Sessions)
|Thursday, 1/28:||12pm – 2:00pm EDT|
|Friday, 1/29:||12pm – 2:00pm EDT|
Instructors: Thomas Green and Robert Lowry
The design and packaging of microelectronic devices such as hybrids, RF microwave modules, Class III medical implants and other types of packaged microcircuits intended for high reliability systems is a critical aspect of reliability engineering. This course is intended to review and highlight the typical kinds of microelectronic packaging related failures that occur during manufacturing, qualification and the unfortunate field failures. FA (failure analysis) tools and techniques that are utilized to understand root cause of failure and guide corrective actions will also be addressed by experts with years of experience working in FA labs.
The instructor shares his years of experience related root cause FA investigations of microcircuit packaging defects and failures. Mismatched CTEs and poorly designed packages geometries often lead to mechanical failure at the die and substrate interface or cracking at the heel of a wire or ribbon bond interconnect. Careful delid, visual inspection followed by SEM and EDAX/Auger are required to identify root cause. Reliability engineers must be cognizant of the full range of FA tools available to diagnose failures and, resist the temptation to rush to judgment, which often happens destroying valuable evidence along the way. The instructor will review real world specific examples of packaging failures and resultant FA analysis and problem resolution. Click here to see the full outline.
The course is intended for FA engineers, component engineers, reliability engineers, design, quality and process engineers involved in microelectronic packaging.