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TJ Green Associates is uniquely qualified to educate individuals in all aspects of microelectronic device assembly, materials/process development, failure analysis, inspection, and defect recognition. Our learning center has many options to meet your company’s unique needs.

virtual pre cap

VIRTUAL: Pre Cap Visual Inspection per MIL-STD-883 (TM 2017) (6/13/2023 – 6/16/2023 OR 11/6/2023 – 11/9/2023)

$995.00
virtual wire bond

VIRTUAL: Copper and Gold Wire Bonding (6/20/2023 – 6/22/2023 OR 10/31/2023 – 11/2/2023)

$895.00
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VIRTUAL: Microelectronic Packaging Failure Modes and Analysis (7/31/2023 – 8/1/2023)

$695.00

VIRTUAL: Design and Test of Non-Hermetic Microelectronics (10/3/2023 – 10/5/2023)

$895.00
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VIRTUAL: Space and Military Standards for Hybrids and RF Microwave Modules (8/21/2023 – 8/22/2023 OR 11/20/2023 – 11/21/2023)

$695.00
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VIRTUAL: Microwave Packaging Technology (9/19/2023 – 9/21/2023)

$895.00
virtual volatiles control

VIRTUAL: Volatiles Control in Hermetic Electronic Components (9/26/2023 – 9/28/2023)

$895.00

VIRTUAL: Thermal Management for High Reliability Electronic Systems (10/17/2023 – 10/19/2023)

$895.00
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VIRTUAL: External Visual Inspection per MIL-STD-883 TM 2009 (11/10/2023)

$395.00
Workmanship eBook Yearly Subscription - Unlimited License

Workmanship eBook Subscription

From: $69.99 / month with a 7-day free trial
semiconductor-training

Online Semiconductor Packaging Training & Certification

$2,500.00
Webinar - Die Bond Wirebond

Webinar – Die Bond Wirebond: Back To Basics

$249.00