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Pre Cap Visual Inspection per Mil-Std-883 (TM 2017) (5/11/20) Boxborough, MA
VIRTUAL: Microelectronic Packaging Failure Modes and Analysis (1/28/2021 – 1/29/2021)
VIRTUAL: Copper and Gold Wire Bonding (1/5/21-1/7/21)
Wire Bonding Certification (12/1/20-12/3/20) Anaheim, CA
Copper and Gold Wire Bonding (5/11/20) Boxborough, MA
VIRTUAL: External Visual Inspection per Mil-Std-883 TM 2009 (12/18/2020)
VIRTUAL: Microwave Packaging Technology (2/2/2021 – 2/4/2021)
Copper and Gold Wire Bonding (4/24/20) Los Angeles, CA
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