Wirebonding complex hybrids and large RF MMIC Microwave Modules present a unique set of challenges for wirebond engineers. There are a myriad of bond pad metallurgies, very small bond pad sizes, differing heights within the package and a variety of loop shape profiles needed in order to assemble the device. Looping is a particular problem because the loop shape can affect RF performance. Gate pads on RF devices are often less than 2 X 2 mils, tail lengths must be tightly controlled in order to avoid damage to nearby air bridges.
