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Several years ago now the DoD tightened up the hermeticity leak rate spec limit for Class K (space qualified) hybrid microcircuits. This two order of magnitude change to the spec has caused companies to explore new leak test equipment.
White Paper – How to Qualify a Wirebond Process to MIL-PRF-38534/5 and MIL-STD-883 Test Specs – iMaps
White Paper – Mil Spec Hermeticity Testing of Class III Medical Implants
White Paper – A Practical Guide to TM 1014 Seal
White Paper – Hermetic vs Near Hermetic Packaging Technical Review
White Paper – Wirebond Challenges in Microwave RF MMIC Modules for Military and Space
Howl and Mann Leak Rate Flex Method Calculator TM-1014
White Paper – Silver Epoxy Turns Black After an Oxygen Plasma Clean Prior to Wire Bonding…But So What?
White Paper – A Critical Review of Wirebond Visual Inspection Criteria
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