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Several years ago now the DoD tightened up the hermeticity leak rate spec limit for Class K (space qualified) hybrid microcircuits. This two order of magnitude change to the spec has caused companies to explore new leak test equipment.
White Paper – Silver Epoxy Turns Black After an Oxygen Plasma Clean Prior to Wire Bonding…But So What?
White Paper – A Critical Review of Wirebond Visual Inspection Criteria
White Paper – Why Three Monolayers of Moisture are Important
White Paper – Minnowbrook 2014 Hermeticity Testing and Issues with Correlation
White Paper – New Release of Mil-Std-883 Visual Inspection
Howl and Mann Leak Rate Flex Method Calculator TM-1014
White Paper – Hermetic vs Near Hermetic Packaging Technical Review
White Paper – Non Hermetic Packaging for Military and Aerospace
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