Copper and Gold Wire Bonding (4/24/20) Los Angeles, CA

WHEN: April 24, 2020
TIME: 8:30am to 4:30pm

Achieving high wirebond yields requires rigorous attention to details and statistical process control. In this one day seminar, taught by our guest Lee Levine, you will learn about ultrasonic welding, intermetallics and intermetallic failures of gold and copper, copper wire bonding, and more in this detailed course meant for wire bond process engineers, technicians, quality control engineers and managers.

This course is intended for new wire bonders, but many experienced bonders and process/quality engineers have taken the course and learned a great deal. The classroom training is open to anyone, but the “hands on” activities are limited to 3 or 4 students at a time due to logistical reasons.

Click here to see the outline.

Location:
Four Points by Sheraton Los Angeles International Airport
9750 Airport Boulevard
Los Angeles, CA 90045
(310) 645-4600