Die attach and wirebond are still the fundamental skill sets required to assemble hybrids, microwave modules and other types of packaged microelectronic modules. This wirebonding webinar is designed to highlight critical material and process issues and emphasize the important steps needed to assemble a quality product. The instructor relies on years of experience and clear graphics to talk through the technical details of epoxy and eutectic solder attach of silicon and delicate gallium arsenide chips. Interconnecting these state of the art devices to the outside world involves gold and aluminum wirebonding, which must be performed to exacting standards.
