SCOPE: How to qualify your wirebond process for use in military and space applications i.e. -55C to 125 C in a harsh environment with a mission service life out to 40 years.
Discussion Points:
• What is a Mil Prf? Vs. MIL-STD-883
• Where do I find the wirebond “qual”, screen test and in-process controls testing
requirements?
• Mil Spec wirebonding qual, screening, in line testing and visual specs
• Recent updates to TM 2017 wirebond specs
• Personal opinion on the mil specs pertaining to wirebond
Summary
Microcircuit Packaging Levels:
Level I: Wafer Level (ICs and MMICs)
Level II: Hybrids, Monolithics Discrete ICs
Level III: Printed Circuit Board (PCBs)
Level IV: Black Box LRU
Level V: System
