The instructor begins by broadly describing microelectronics packaging terminology and reviews the alphabet soup of acronyms used throughout the electronics industry; terms such as: DIP, LCC, QFN, BGA, CSP, Flip Chip, 3D, TSV, WLP, SIP ect

The technology is then broken down by industry segments, beginning with high volume commercial packaging technology used in cell phones, tablets and handheld wireless devices, automotive, telecom, Internet of Things (IoT) and then progressing onto specialized packaging for low volume complex devices used in military hardware, Aerospace, Class III medical implants, Automotive, Commercial, Oil and Gas exploration as well as, RF microwave circuits, optoelectronics, LEDs and next generation packaging of MEMS and sensors.

Special emphasis on advanced packaging technologies such as FO-WLP Fan-Out Wafer Level Packaging as shown in the photo on the left.